XL-Density devices dual boot capability

  ******************** (C) COPYRIGHT 2010 STMicroelectronics *******************
  * @file    FLASH/Dual_Boot/readme.txt 
  * @author  MCD Application Team
  * @version V3.4.0
  * @date    10/15/2010
  * @brief   Description of the FLASH Dual_Boot Example.
  ******************************************************************************
  * THE PRESENT FIRMWARE WHICH IS FOR GUIDANCE ONLY AIMS AT PROVIDING CUSTOMERS
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Example Description

This example demonstrates the dual Flash boot capability of XL-Density devices: boot from Flash memory Bank1 or Bank2.

At startup, if BFB2 option bit is reset and the boot pins are in the boot from main Flash memory configuration, the device boots from Flash memory Bank1 or Bank2, depending on the activation of the bank. The active banks are checked in the following order: Bank2, followed by Bank1. The active bank is identified by the value programmed at the base address of the bank (corresponding to the initial stack pointer value in the interrupt vector table). For further details, please refer to AN2606 "STM32 microcontroller system memory boot mode."

To demonstrate this feature, this example provides two programs:

Once these two programs are loaded and boot pins set in boot from Flash memory, after reset the device will boot from Bank1 (default). Then you have to follow the instructions provided on the LCD:

Important Note ================= When BFB2 bit is cleared and Bank2 or/and Bank1 contain valid user application code, the Bootloader will always jump to this code and never continue normal code execution (i.e. itís no more possible to use the Bootloader for code upgrade and option bytes programming). As consequence, if the user has cleared BFB2 bit (to boot from Bank2), in order to be able to execute the embedded Bootloader code he has to:

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Hardware and Software environment
How to use it ?

In order to load the IAP code, you have to do the following:

Note:
  • Low-density Value line devices are STM32F100xx microcontrollers where the Flash memory density ranges between 16 and 32 Kbytes.
  • Low-density devices are STM32F101xx, STM32F102xx and STM32F103xx microcontrollers where the Flash memory density ranges between 16 and 32 Kbytes.
  • Medium-density Value line devices are STM32F100xx microcontrollers where the Flash memory density ranges between 64 and 128 Kbytes.
  • Medium-density devices are STM32F101xx, STM32F102xx and STM32F103xx microcontrollers where the Flash memory density ranges between 64 and 128 Kbytes.
  • High-density Value line devices are STM32F100xx microcontrollers where the Flash memory density ranges between 256 and 512 Kbytes.
  • High-density devices are STM32F101xx and STM32F103xx microcontrollers where the Flash memory density ranges between 256 and 512 Kbytes.
  • XL-density devices are STM32F101xx and STM32F103xx microcontrollers where the Flash memory density ranges between 512 and 1024 Kbytes.
  • Connectivity line devices are STM32F105xx and STM32F107xx microcontrollers.

© COPYRIGHT 2010 STMicroelectronics

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